ASE Technology Holding CoLtd ADR
ASE Technology Holding CoLtd ADR (ASX) Covered Calls
ASE Technology Holding CoLtd ADR trades in the Semiconductors industry with an IV Rank of 71.03%, high versus the past year. ASX's highest covered call setup is the $45.00 strike expiring Nov 20, 2026, sorted by theoretical annualized return. It's 24.00% out of the money with 8 days to expiration, a 24.14% return until expiration, and a 1,101.34% theoretical annualized return. Across the setups shown, annualized returns run from 268.16% to 1,101.34% at strikes between $37.50 and $70.00, with 8 to 127 days to expiration, as of Nov 12, 2026.
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Running ASX covered calls helps you generate income from ASE Technology Holding CoLtd ADR shares you already own, turning a long stock position into a yield producing asset. A covered call means holding the underlying stock and selling a call option against it, collecting premium in exchange for capping upside at the strike. Use our scanner to find the best ASX covered calls in real time and filter for the strikes, expiries, and premiums that fit your strategy.
A covered call pairs limited risk with a clear income profile. If ASX stays below the strike at expiration, you keep the premium and the shares. If it rises above, you deliver the stock at the strike and still pocket the premium. Selling ASX covered calls works best when implied volatility is elevated, since richer premiums improve the risk reward. Key inputs include strike selection relative to delta, days to expiration, annualized return, and probability of assignment, all of which determine whether a given ASX covered call is worth writing.
ASE Technology Holding Co., Ltd. provides a range of semiconductors packaging and testing, and electronic manufacturing services in the United States, Taiwan, rest of Asia, Europe, and internationally. It offers packaging services, including flip chip ball grid array (BGA) and chip scale package (CSP), advanced chip scale packages, quad flat packages, low profile and thin quad flat packages, bump chip carrier and quad flat no-lead (QFN) packages, advanced QFN packages, plastic BGAs, and 3D chip packages; stacked die solutions in various packages; and copper and silver wire bonding solutions. The company also provides advanced packages, such as flip chip BGA; heat-spreader FCBGA; flip-chip CSP; hybrid FCCSP; flip chip package in package and package on package (POP); advanced single sided substrate; high-bandwidth POP; fan-out wafer-level packaging; SESUB; and 2.5D silicon interposer.
| 2026-11-20 | 8 | 45.00 | 24.00 | 0.05 | 0.10 | 876.00 | 24.14 | 1101.34 | -0.14 | +0.04 | 1,448 | 0.05 |
| 2026-11-20 | 8 | 42.50 | 17.11 | 0.10 | 0.20 | 631.00 | 17.39 | 793.31 | -0.28 | +0.09 | 1,175 | 0.10 |
| 2026-11-20 | 8 | 40.00 | 10.22 | 0.30 | 0.65 | 401.00 | 11.05 | 504.15 | -0.83 | +0.21 | 1,129 | 0.35 |
| 2026-12-18 | 36 | 52.50 | 44.67 | 0.05 | 0.40 | 1626.00 | 44.81 | 454.28 | -0.14 | +0.07 | 497 | 0.35 |
| 2026-12-18 | 36 | 50.00 | 37.78 | 0.15 | 0.60 | 1386.00 | 38.19 | 387.23 | -0.41 | +0.10 | 1,255 | 0.45 |
| 2027-01-15 | 64 | 60.00 | 65.33 | 0.10 | 0.25 | 2381.00 | 65.61 | 374.18 | -0.28 | +0.05 | 2,551 | 0.15 |
| 2026-12-18 | 36 | 47.50 | 30.89 | 0.25 | 0.60 | 1146.00 | 31.58 | 320.18 | -0.69 | +0.12 | 380 | 0.35 |
| 2027-01-15 | 64 | 55.00 | 51.56 | 0.20 | 0.40 | 1891.00 | 52.11 | 297.18 | -0.55 | +0.08 | 418 | 0.20 |
| 2026-11-20 | 8 | 37.50 | 3.33 | 0.95 | 1.20 | 216.00 | 5.95 | 271.56 | -2.62 | +0.41 | 635 | 0.25 |
| 2027-03-19 | 127 | 70.00 | 92.89 | 0.15 | 0.60 | 3386.00 | 93.30 | 268.16 | -0.41 | +0.07 | 49 | 0.45 |
As of Nov 12, 2026
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- IndustrySemiconductors
- SectorTechnology
- IV Rank71.03% High
- Market cap (M$)80,113
- 52 weeks high-24.29%
- 52 weeks low172.04%
- Analyst recommendationStrong Buy
1.00 - Target price$58.00
62.88% above the current stock price - Dividend—
- Payout ratio49.86%
- Earnings date2027-02-04
- P/E34.40
- Future P/E17.58
- EPS (ttm)1.05
- EPS growth next 5 years69.30%
As of Nov 12, 2026