ASE Technology Holding CoLtd ADR
ASE Technology Holding CoLtd ADR (ASX) Unusual Options Activity Today
ASX's highest volume power reading is 269.83%, on the $32.5 PUT expiring Nov 20, 2026. This strike traded 939 contracts against just 348 in open interest. On the call side, the highest reading is the $40 CALL expiring Nov 20, 2026 at 3.90%, with 44 contracts traded against 1,129 open, as of Nov 12, 2026.
Read more
Checking ASX unusual options activity helps you spot when traders are making outsized bets on ASE Technology Holding CoLtd ADR before the broader market catches on. Unusual activity flags contracts trading at multiples of their average daily volume, often signaling informed money positioning ahead of a catalyst. Use our scanner to monitor ASX unusual options activity today and surface the prints that deserve a second look.
Unusual options flow typically means volume vastly exceeds open interest at a given strike, or total contract volume on a name spikes well above its norm. Watching ASX unusual options flow today can reveal large block trades, sweeps across exchanges, and aggressive directional bets. Tracking ASX unusual options volume across calls and puts helps you separate hedging from genuinely speculative positioning, especially valuable around earnings, product launches, and macro events.
ASE Technology Holding Co., Ltd. provides a range of semiconductors packaging and testing, and electronic manufacturing services in the United States, Taiwan, rest of Asia, Europe, and internationally. It offers packaging services, including flip chip ball grid array (BGA) and chip scale package (CSP), advanced chip scale packages, quad flat packages, low profile and thin quad flat packages, bump chip carrier and quad flat no-lead (QFN) packages, advanced QFN packages, plastic BGAs, and 3D chip packages; stacked die solutions in various packages; and copper and silver wire bonding solutions. The company also provides advanced packages, such as flip chip BGA; heat-spreader FCBGA; flip-chip CSP; hybrid FCCSP; flip chip package in package and package on package (POP); advanced single sided substrate; high-bandwidth POP; fan-out wafer-level packaging; SESUB; and 2.5D silicon interposer.
| 40.00 | 0.30 | 0.65 | 0.48 | 78% | 44 | 1,129 | 3.90% |
| 37.50 | 0.95 | 1.20 | 1.08 | 74% | 10 | 635 | 1.57% |
| 35.00 | 2.15 | 2.45 | 2.30 | 75% | 9 | 594 | 1.52% |
| 42.50 | 0.10 | 0.20 | 0.15 | 76% | 9 | 1,175 | 0.77% |
| 55.00 | — | 0.40 | 0.40 | 195% | 3 | 1,320 | 0.23% |
| 32.50 | 0.30 | 0.45 | 0.38 | 81% | 939 | 348 | 269.83% |
| 37.50 | 1.95 | 2.35 | 2.15 | 69% | 15 | 624 | 2.40% |
| 40.00 | 3.70 | 4.40 | 4.05 | 71% | 3 | 637 | 0.47% |
| 35.00 | 0.55 | 1.10 | 0.83 | 67% | 4 | 2,766 | 0.14% |
| 30.00 | 0.05 | 0.15 | 0.10 | 84% | 3 | 6,064 | 0.05% |
As of Nov 12, 2026
Prices move. This one stays.Lock in 5 years at a special price and save $2,243. Ending soon.See the Early Bird Black Friday deal →