Option Chain

ASE Technology Holding CoLtd ADR

ASXNYSE · USD

35.55USD0.00 (-2.04%)

7710

ASE Technology Holding CoLtd ADR (ASX) Option Chain

ASE Technology Holding CoLtd ADR trades at $35.55, down 2.04%, with an IV Rank of 73.41%. This is high versus the past year, and the company carries a market cap of $78,479M in the Semiconductors industry. On the Nov 20, 2026 chain, the at the money $35.00 strike shows calls at $2.15 / $2.45 and puts at $0.55 / $1.10, both carrying about $1.29 of extrinsic value and a roughly 50% probability of expiring out of the money. Volume is heaviest on the $40.00 calls, at 44 contracts, and the $32.50 puts, at 939, as of Nov 12, 2026.

Tracking the ASX option chain helps you see every strike and expiry on ASE Technology Holding CoLtd ADR in one view, so you can quickly identify contracts that fit your thesis and your risk. It lays out bids, asks, volume, open interest, and Greeks across calls and puts, giving you the full map of ASX options activity at a glance. Use our scanner to monitor the ASX option chain in real time and filter for the trades that actually meet your criteria.

An option chain is the complete listing of all available option contracts on an underlying, organized by expiration date and strike price. For ASX stock options, the chain shows call and put data side by side, making it easy to compare premiums, assess liquidity, and spot pricing dislocations. Reading it well means looking beyond the last price. Implied volatility by strike, volume to open interest ratios, and bid ask spreads all show where ASX options are being actively traded, and where they are not.

ASE Technology Holding Co., Ltd. provides a range of semiconductors packaging and testing, and electronic manufacturing services in the United States, Taiwan, rest of Asia, Europe, and internationally. It offers packaging services, including flip chip ball grid array (BGA) and chip scale package (CSP), advanced chip scale packages, quad flat packages, low profile and thin quad flat packages, bump chip carrier and quad flat no-lead (QFN) packages, advanced QFN packages, plastic BGAs, and 3D chip packages; stacked die solutions in various packages; and copper and silver wire bonding solutions. The company also provides advanced packages, such as flip chip BGA; heat-spreader FCBGA; flip-chip CSP; hybrid FCCSP; flip chip package in package and package on package (POP); advanced single sided substrate; high-bandwidth POP; fan-out wafer-level packaging; SESUB; and 2.5D silicon interposer.

CALLs									PUTs
Prob. OTM %	Open Interest	Volume	Extrinsic Value	Intrinsic Value	Bid	Ask	Strike	Moneyness %	Bid	Ask	Intrinsic Value	Extrinsic Value	Volume	Open Interest	Prob. OTM %
2.53	2,018	1	0.60	5.55	5.30	7.00	30.00	-17.33	0.05	0.15	0.00	0.10	3	6,064	97.47
13.21	317	0	0.90	3.05	3.20	4.70	32.50	-10.44	0.30	0.45	0.00	0.38	939	348	86.79
36.68	594	9	1.75	0.55	2.15	2.45	35.00	-3.55	0.55	1.10	0.00	0.83	4	2,766	63.32
64.88	635	10	1.08	0.00	0.95	1.20	37.50	+3.33	1.95	2.35	1.95	0.20	15	624	35.12
85.49	1,129	44	0.48	0.00	0.30	0.65	40.00	+10.22	3.70	4.40	4.45	-0.40	3	637	14.51

As of Nov 12, 2026

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Stock Statistics

IndustrySemiconductors
SectorTechnology
IV Rank73.41% High
Market cap (M$)78,479
52 weeks high-25.83%
52 weeks low166.49%
Analyst recommendationStrong Buy
1.00
Target price$58.00
63.15% above the current stock price
Dividend—
Payout ratio49.86%
Earnings date2027-02-04
P/E33.70
Future P/E17.22
EPS (ttm)1.05
EPS growth next 5 years69.30%

As of Nov 12, 2026

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